Dimensity 1050: First MediaTek SoC With Support For 5G mmWave

The Taiwanese company MediaTek has announced the arrival of the new Dimensity 1050 mobile processor, its first processor with support for dual 5G mmWave and sub-6GHz connectivity.

The new chipset is built under a 6 nm process and is slightly scaled-down version of the Dimensity 1100. The integrated CPU uses octa-core architecture, two of which are ARM Cortex-A78 clocks at 2.5 GHz. The company hasn’t dwelled on the characteristics of the remaining cores, but it is likely that they are six Cortex-A55s.

The chip also received an ARM Mali-G610 GPU core with support for MediaTek HyperEngine 5.0. The latter offers additional tools and optimization features to improve performance in games. The SoC supports UFS 3.1 flash storage, LPDDR5 RAM, Full HD + displays with up to 144Hz refresh rate, AV1 video decoding in hardware, HDR10 + playback and Dolby Vision.

MediaTek Dimensity 1050

MediaTek hasn’t specified the modem used in the SoC, but the company released its first 5G modem with mmWave, the M80, in early 2021. In addition to 5G capabilities, the company is also touting improvements in Wi-Fi speeds with tri-band support for 2.4GHz, 5GHz, and 6GHz connections and Wi-Fi 6E. 

The first devices powered by MediaTek Dimensity 1050 will be available on the market between July and September 2022.

MediaTek Dimensity 930 5G

MediaTek Dimensity 930 is the successor of Dimensity 920. The MediaTek Dimensity 930 promises cheaper 5G smartphones with 120 Hz fast 1080p+ displays, HDR10+ video recording and a long battery life. Dimensity 930, however, supports UFS 3.1 storage and LPDDR5 RAM memories, features until now reserved only for the top tiers. The first smartphones with Dimensity 930 are expected in the second quarter of 2022.

MediaTek Helio G99 LTE

MediaTek Helio G99 is designed to offer a good quality gaming experience in the mid-range, guaranteeing up to 30% more energy efficiency than its predecessor. The new SoC uses a different CPU architecture, offering two 2.2GHz Cortex-A76 cores and six 2.0GHz Cortex-A55 cores. On the connectivity side, the SoC stops at LTE networks, with support for dual SIM and VoLTE and ViLTE services, and support for WiFi 5, Bluetooth 5.2 and FHD + 120Hz display is guaranteed. On the graphics side we find an ARM Mali-G57 MC2 GPU, while the memory compartment can be based on LPDDR4X RAM and UFS 2.2 storage. The first smartphones with Helio G99 will hit the market by the end of the third quarter of this year.

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