The Dimensity 7000 series is MediaTek’s latest mid-range mobile SoC platform, with the Dimensity 7200 coming out in the next weeks.
The mid-range CPU, just like the flagship Dimensity 9200 chip, is manufactured on TSMC’s 4nm technology. It has an eight-core CPU, two Cortex-A715 cores and six Cortex-A510 cores, and a dedicated processor for AI systems.
The new platform configuration includes two Cortex-A715 cores with a frequency of 2.8 GHz and six Cortex-A510 cores with an unspecified frequency. This is the first platform with such a set of cores. The Mali-G610 MC4 acts as the GPU, which makes it excellent for gaming, and it supports Full HD+ screens with a refresh rate of 144Hz. The wireless module supports Wi-Fi 6E, Bluetooth 5.3, and a Release-16 5G modem with a frequency range of up to 6 GHz.
The platform will handle RAM speeds up to 6400 Mbps and improve the photography experience with MediaTek’s artificial intelligence systems. The Dimensity 7200 is intended to be utilised in mid-range smartphones, covering the gap between the Dimensity 8000 and the Dimensity 900/1000.
The MediaTek Dimensity 7200 has LPDDR5 memory, UFS 3.1 storage, and compatibility for cameras with up to 200MP resolution. The 4nm manufacturing technology improves the processor’s energy efficiency, making it an attractive option for budget smartphones. The first smartphones powered by the Dimensity 7200 processor are set to hit the market in the first quarter of 2023.
The MediaTek Dimensity 7200 is an excellent addition to the growing mid-range smartphone market. Its powerful features will improve users’ gaming and photography experiences. We’re interested to see which smartphones will be the first to use the Dimensity 7200 and what innovations this new CPU will bring to the mobile phone market.
