The M1 Pro and M1 Max — the new Apple Silicon processors, are proving to be one of the most powerful SoCs today. However, the next generation promises to make an even bigger leap.
A report by The Information gives an insight into Apple’s alleged processor roadmap. The roadmap for Apple Silicon processors begins with what could be the M2 or M2 Pro chip. This SoC, initially, will be integrated into MacBook Pros and Mac desktops released next year. In this case, it is expected that the 5 nm architecture of the manufacturer TSMC will be maintained, but with an improved process that will allow the inclusion of more cores and, therefore, higher performance compared to current Apple chips.
As per the report, Apple’s processor roadmap provides for three chips developed under the code names Ibiza, Lobos and Palma, which should form the M3 generation for 2023. The third-generation Apple Silicon processors would arrive with a new 3-nanometer manufacturing process, also thanks to TSMC, the main chip supplier for the Cupertino company.
We are talking about processors with up to four dies, which provide a total of up to 40 CPU cores. That would be a multi-chip module architecture, as you can currently find at AMD Ryzen, Threadripper or Epyc — which use up to eight dies and are also equipped with a separate I/O die.
For Apple, the presumably powerful processors could be of particular importance in the upcoming iMac Pro and Mac Pro. Judging by the M1 processor, in the future, Apple processors will break even further with Intel processors.
