As next year approaches, chipmakers prepare new choices for future smartphones, as MediaTek demonstrates with the launch of the new Dimensity 8200 — after presenting the powerful Dimensity 9200, designed and created for the most valuable smartphones.
Its predecessor, the Dimensity 8100, can be found on products such as Xiaomi 12T, Redmi K50, POCO X4 GT, OPPO Reno 9 Pro, OnePlus 10R, Realme GT Neo 3 and Honor 70 Pro.
While not the most premium SoC in MediaTek’s catalogue, the Dimensity 8200 benefits from the same 4nm TSMC manufacturing process that pricier chips boast. Inside, we find a more powerful processor than the Dimension 8100, which is a tri-cluster octa-core CPU: 1 x 3.1 GHz A78 + 3 x 3.0 GHz A78 + 4 x 2.0 GHz A55.
The graphics part is entrusted to the Mali-G610 MC6 GPU, unchanged but with a peak frequency that rises from 850 to 950 MHz. The gaming component is managed by the technologies that make up the HyperEngine 6.0 suite, including the Frame Rate Smoother 2.0 and Smart Resource Optimization for CPU performance allocation.
Memory side, the new MediaTek SoC maintains quad-channel LPDDR5 support at 3200 MHz with bandwidth at 51.2 GB/s, and the MediaTek APU 580. What changes is the ISP, the 14-bit MediaTek Imagiq 785 HDR with photo support for sensors up to 320MP, HDR video dual exposure and 4K 60fps support and bokeh video; alongside it is the MediaTek MiraVision 785, which allows the implementation of Full HD + screens up to 180 Hz and WQHD up to 120 Hz, with Display Sync 2.0, 4K AV1 decoder and AI SDR-to-HDR.
Connectivity includes a 5G 3GGP Release 16 modem with UltraSave 2.0 and 3CC Carrier Aggregation (200 MHz) 5G sub-6 GHz, as well as Wi-Fi 6E 2×2 and Bluetooth 5.3 with LE Audio and Dual-Link TWS Stereo Audio.
The first few smartphones to mount the MediaTek Dimensity 8200 might be the iQOO Neo 7 SE and Redmi K60.