MediaTek has recently announced the launch of its latest SoC for mobile devices, the Dimensity 8300 — offering a blend of enhanced performance and energy efficiency.
The Dimensity 8300 is described by MediaTek as a more cost-effective solution for premium phones. This chip is manufactured using the efficient 4nm process by TSMC, ensuring both performance and power efficiency. The CPU features an octa-core setup, including a Cortex-A715 Prime core with a peak frequency of 3.35 GHz, three large Cortex-A715 cores at 3.0 GHz, and four smaller Cortex-A510 cores at 2.2 GHz for less demanding tasks.
The GPU, a Mali-G615, not only offers improved graphical performance but also supports advanced visual features. These include 120 Hz refresh rates at WQHD+ resolution (and 180 Hz in FHD), HDR10+ high dynamic range, and 4K AVI media decoding. Additionally, the chipset includes a new AI APU 780, based on the architecture of the top-tier Dimensity 9300‘s NPU, enhancing AI processing capabilities.
Performance and Efficiency
MediaTek promises significant improvements across all aspects while maintaining power consumption. The key advancements include:
- A 20% faster CPU with 30% more energy efficiency.
- A 60% faster GPU, also 55% more energy-efficient.
- A 330% boost in AI performance, doubling INT and FP16 calculations.
The Dimensity 8300 supports faster memory and storage, including LPDDR5X-8533 MHz RAM and UFS 4.0. It can handle camera sensors up to 320 megapixels and 4K video recording at 60 fps. The chip also supports 5G networks, Wi-Fi 6E, and Bluetooth up to version 5.4.
The chipset is expected to be available by the end of the year through MediaTek’s partners, likely featuring in phones from brands like HONOR, Realme, Xiaomi, Oppo, and Vivo.
