MediaTek has introduced its latest SoC, the Dimensity 9300, designed to redefine the premium smartphone experience and aiming to go toe-to-toe with the likes of Qualcomm’s Snapdragon 8 Gen 3.
The Dimensity 9300 is MediaTek’s answer to the growing demand for high-performance, energy-efficient mobile processors. With an architecture that MediaTek has dubbed “all big cores,” the chip promises a significant boost in CPU and GPU performance, alongside enhanced capabilities for artificial intelligence processing, particularly in generative AI tasks.
Crafted using the advanced third-generation 4-nanometer process from TSMC, the Dimensity 9300’s octa-core CPU features four of the latest Cortex-X4 cores at 3.25 GHz and four Cortex-A720 cores at 2.0 GHz. MediaTek’s strategy is clear — to maximize processing power without sacrificing energy efficiency. The chip achieves a 33% reduction in energy consumption compared to its predecessor, the Dimensity 9200, and boasts a 15% increase in single-core performance and a 40% improvement in multi-core operations.
Graphics performance is another arena where the Dimensity 9300 shines. It incorporates ARM’s latest GPU, the Immortalis-G720, which, according to MediaTek, outperforms its predecessor by 46% without any additional power draw. Furthermore, energy consumption has been slashed by up to 40% when matching the performance of the previous GPU.
Aiming to dominate the mobile gaming market, the Dimensity 9300 supports ray tracing with new indirect lighting effects at 60 frames per second, promising an immersive gaming experience with console-quality graphics.
The chip’s prowess extends to artificial intelligence with the new APU 790, which outperforms its predecessor while consuming up to 45% less energy. Like Qualcomm’s Snapdragon 8 Gen 3, the Dimensity 9300 aims to harness the full potential of AI in mobile devices. This includes enhancements in photography and video capture, enabling users to record in 4K at 30 frames in cinematic mode with professional-grade, real-time subject and background separation.
Moreover, the APU 790 facilitates the local execution of massive language models such as Meta’s LLaMA 2 and Baidu’s Ernie 3.5, supporting LLMs from 1 billion to 13 billion parameters, scalable up to 33 billion parameters. MediaTek also claims that the chipset can generate images in Stable Diffusion in just one second, a capability akin to Qualcomm’s recent assertions for the Snapdragon 8 Gen 3.
The Dimensity 9300 is future-ready, optimized for LPDDR5T memory at 9,600 Mbps, UFS 4.0 storage, and high-refresh-rate displays, including compatibility with WQHD panels at 180 Hz and 4K at 120 Hz. It also supports camera sensors up to 320 megapixels.
In terms of connectivity, the Dimensity 9300 supports Wi-Fi 7 with speeds up to 6.5 Gbps and 5G networks. Devices powered by this new SoC are expected to hit the market before the year’s end, though the specific brands adopting it first remain under wraps.
